Electronic and semiconductor devices rely on precise material performance at both the macro and microscopic levels. From integrated circuits and printed circuit boards to thin films and encapsulation materials, even minor variations in composition, contamination, or structure can impact reliability, signal integrity, and long-term performance.
Analytical techniques such as FTIR, SEM, XPS, AES, and metallurgical analysis are used to investigate these materials from multiple perspectives—bulk chemistry, surface composition, microstructure, and failure mechanisms. In many cases, understanding how these factors interact is critical to identifying the root cause of defects or performance issues.
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